COF bonding machine is a automatic COF(chip on film) bonding device. As the best packaging technology for full screen, COF is especially suitable for full screen to achieve the minimum border width.
- Accuracy: ±4 um(3σ)
- Bonding pressure: 10～150 N
- Bonding Temperature: RT～150 ℃
- CCD vision alignment, closed-loop control and precise alignment station are used to ensure high accuracy.
- Adaptive PID control algorithm is adopted to control pressure and temperature.
- High quality imported components are used to ensure the long-term stability of the equipment.