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Home >> Products >> COF Bonding

COF Overview

COF bonding machine is a automatic COF(chip on film) bonding device. As the best packaging technology for full screen, COF is especially suitable for full screen to achieve the minimum border width.

Main Parameters

  • Accuracy: ±4 um(3σ)
  • Bonding pressure: 10~150 N
  • Bonding Temperature: RT~150 ℃

Main Features

  • CCD vision alignment, closed-loop control and precise alignment station are used to ensure high accuracy.
  • Adaptive PID control algorithm is adopted to control pressure and temperature.
  • High quality imported components are used to ensure the long-term stability of the equipment.